SHC MACHINE

Professional semiconductor equipment supplier from China.

Innovative Solution for Innovative Products

The 2200 evoplus die bonder for Multi Module Attch assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. 
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

Integrated Dispenser

• Pressure/time (Musashi®), Auger, Jetter types available
• Epoxy stamping option
• Filled and unfilled epoxy, wide viscosity range
• Small footprint, low cost-of-ownership

Vision Alignment

• New high-speed image processing unit 
• Full alignment & Bad mark search
• Pre-defined fiducial geometry & customized teaching

Automatic Wafer and Tool Changer

• Fully Automatic cycle for Multi-Chip production
• Up to 7 Pick & Place tools (optionally 14), 5 eject tools
• Stamping tools and calibration tools possible

Pick & Place Head

• Die Attach, Flip Chip and Multi-chip in one machine
• Die pick from: wafer, waffle pack, Gel-Pak®, feeder
• Die place to: substrate, boat, carrier, PCB, leadframe, wafer
• Hot and cold processes supported: 
epoxy, soldering, thermo-compression, eutectic